PCB工程英文确认常用词及常用语句.docxVIP

PCB PCB 工程英文用语句汇总 PAGE PAGE 1 规格：spec 工程问题：engineering query（EQ） 生产文件：production gerber 电测成本：ET（electrical test） cost 通断测试：Open and short testing IPC 标准：IPC standard IPC 二级：IPC class 2 修改：revision 公差：tolerance 忽略：ignore(omit) 工具孔：tooling hole 安装孔：mounting hole 元件孔：component hole 槽孔：slot 邮票孔：snap off hole 导通孔：via 盲孔： blind via 埋孔：buried via 金属化孔：PTH(plating through hole) 非金属化孔：NPTH( no plating through hole) 孔位：hole location 附边：waste tab 铜条：copper strip 拼板强度：panel strong 板厚：board thickness 削铜：shave the copper 露铜：copper exposure 光标点：fiducial mark 内弧：inside radius 焊环：annular ring 单板尺寸：single size 拼板尺寸：panel size 铣：routing 铣刀：router V-cut：scoring 哑光：matt 光亮的：glossy 锡珠：solder ball(solder plugs) 阻焊：solder mask(solder resist) 阻焊开窗：solder mask opening 单面开窗：single side mask opening 补油：touch up solder mask 补线：track welds 毛刺：burrs 去毛刺：deburr 镀层厚度：plating thickness 清洁度：cleanliness 离子污染：ionic contamination 阻燃性：flammability retardant 黑化：black oxidation 棕化：brown oxidation 红化：red oxidation 可焊性：solderability 焊料：solder 角标：corner mark 特性阻抗：characteristic impedance 正像：positive 负片：negative 镜像：mirror 线宽：conductor width 线距：conductor spacing 做样：build sample 成品：finished 下移：shift down 垂直地：vertically 水平的：horizontally 波峰焊：wave solder 钻孔数据：drilling date Ul 标记：Ul Marking 蚀刻标记：etched marking 周期：date code 翘曲：bow and twist 外层：outer layer 内层：internal layer 顶层：top layer 底层：bottom layer 元件面：component side 焊接面：solder side 阻焊层：solder mask layer 丝印层：legend layer (silkscreen layer or over layer) 兰胶层：peelable SM layer 贴片层：paste mask layer 碳油层：carbon layer 外形层：outline layer(profile layer) 白油：white ink 绿油：green ink 喷锡：hot air leveling (HAL) 水金：flash gold 插头镀金：plated gold edge-board contacts 金手指：Gold-finger 防氧化：Entek(OSP) 沉金：Immersion gold (chem. Gold) 沉锡：Immersion Tin(chem.Tin) 沉银：Immersion Silver (chem. silver) 单面板：single sided board 双面板：double sided board 多层板：multilayer board 刚性板：rigid board 挠性板：flexible board 刚挠板：flex-rigid board 铣：CNC (mill , routing) 冲：punching 倒角：beveling 倒斜角：chamfer 倒圆角：fillet 尺寸