封装技术课件 Eutectic_Solder_Die_Attach_for_High-Powered_Devices.docxVIP

Eutectic Solder Die Attach for High-Powered Devices \o Die bonding Die bonding?with eutectic solder processing is becoming more important as thermal challenges increase with the proliferation of? \o laser diode assemblies laser diode assemblies. A solder joint functions as both the electrical contact and the primary heat transfer interface between the die and its substrate. Lasers also require precise temperature control during operation, and the required drive current rises rapidly with increased operating temperatures. Without a robust thermal interface, increased device temperatures se