封装技术课件 Mechanism of void and crack in IMC.pptVIP

GSDE Mechanism of void and crack in IMC SAE Magnetics (HK) Ltd. SAE Confidential GPPE Dept—GPE-1. Liquid solder First dendrite forms More dendrite formed And liquid solder between dendrite is consumed much If there is not enough liquid to refill gaps between dendrite during solidification, gaps (micro void) remains Also shrinkage in solidification would induce micro crack from the gaps General mechanism Characteristics in SBB Solder area IMC area Solder area IMC area Rapid cooling rate Relative coarse IMC Much shrinkage surface gaps Micro void or crack Much nucleus for IMC Possible improv