封装技术课件 void.pptVIP

Summary Report Prepared by: Chen Hongtao\Tian Dewen Peng Liping\Xiao Yuying Checked by: Wang Yanbin\Jackie Wong 1\4,2005 Content Solder joint shape simulation Au-Sn IMC physical properties testing Solder joint reliability with voids inside PSA,RSA, and Crown change IMC morphologies and failure modes under different conditions 3.Voids origin, formation mechanism and its influence on solder joint reliability Void origin investigation Void formation process Void influence on solder joint reliability 3.1 Void origin investi