封装技术课件 Open isuue for TSB HSA.pptVIP

  • 2
  • 0
  • 约2.12千字
  • 约 8页
  • 2022-08-05 发布于安徽
  • 举报
Background Open issue and cause analysis Next action TDK Corporation HPE-1 June 15, 2012 FA for QST defect in universal line ──Open issue for TSB HSA Content Main-view Side-view Incoming Pre-solder FPC No connection Background Open issue is a troublesome problem in T-universal line. Samples with open issue are covert so that it usually can’t be detect by visual from main-view, which have a great impact on the output as well as costing. Therefore, it is necessary to solve the issue as soon as possible. As shown in the SEM images we observed that the obvious open issue which might

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