封装技术课件 Literature brief of crack.pptVIP

2002/12/05 Indy/Monza Program Meeting Surya Pattanaik Literature brief of crack GPE-1 Content Background Experiment Results Discussion Conclusion Acknowledgement Background Voids in a solder joint can reduce their fatigue life. Owing to the mismatch of coefficient of thermal expansion (CTE) between component, solder, and substrate material, cyclic thermomechanical stresses and strains are generated in the solder joint when the module experiences temperature changes in service. These developed stresses and strains will eventually result in microstructural coarsening and crack ini