封装技术课件 solder ball compare.pptVIP

2002/12/05 Indy/Monza Program Meeting Surya Pattanaik The Influence Of Solder On T9 2008.11.18 Content Background Experiment Results Hypothesis Conclusion Background Background Experiment The influence of solder oxidation on T9 rate. Solder ball:M705 Solder exposed to air 12hrs. SBB process: Normal SBM process. Machine: 169# SBM The influence of solder bumped on T9 rate. Solder ball:M705 Solder bumped in N2 4hrs. SBB process: Normal SBM process. Machine: 169# SBM Results T9 rate compare Results Results Hypothesis Hypothesis Hypothesis Conclusion Bumped solder ball would increase risk of T