封装测试工艺技术管理教育资料.pptxVIP

封装测试工艺教育资料1 封装形式IC PKG插入实装形外表实装形DIP：DIP、SHDSSIP、ZIPPGAFLAT PACK：SOP、QFP、CHIP CARRIER：SOJ、QFJ、LCC、TABBGA、CSPIC CARDCOB其他2 PGACSPTBGAPBGAQFPTSOPSOJDIPLOGICMEMORY外形尺寸减少腿数增加封装形式的开展3 SGNEC现有封装形式4 19941996199519971998199920004M SDRAM26pin SOJPitch: 1.27Lead width:0.45Thickness: 2.6020pin SOPPitch: 1.27Lead width:0.40Thickness: 2.6016M SDRAM42pin SOJPitch: 1.27Lead width:0.45Thickness: 2.6064M SDRAM54pin TSOPPitch: 0.80Lead width:0.32Thickness: 1.0044pin QFPPitch: 0.80Lead width:0.40Thickness: 2.70组装技术指标:Pitch: 1.27→0.80Thichness: 2.60→1.00SGNEC组立开展历程7,8,9pin SSIPPitch:2.54Lead width