SMT常用术语中英文对照.pdfVIP

SMT常用术语中英文对照

SMT常用术语中英文对照微組裝技術﹕MPT/Microelectronic

Packagingechnology

混裝技術﹕MixedComponentMountingTechnology

封裝﹕Package

貼片﹕PickandPlace

拆焊﹕Desoldering

再流﹕Reflow

浸焊﹕DipSoldering

拖焊﹕Dragsoldering

印制電路﹕PrintedCircuit

印制線路﹕PrintedWiring

印制電路板﹕printedcircuitboard

印制線路板﹕printedwiringboard

層壓板﹕laminate

覆铜銅薄层壓板﹕copper-cladlaminate

基材﹕basematerial

成品板﹕productionboard

印刷﹕printing

導電圖形﹕conductivepattern

印制元件﹕printedcomponent

單面印制板﹕single-sidedprintedboard

雙面印制板﹕double-sidedprintedboard

多層印制板﹕multilayerprintedboard

電烙鐵﹕Iron

熱風嘴﹕hotairreflowingnoozle

吸錫帶﹕solderingwick

吸錫器﹕tinextractor

焊後檢驗﹕post-solderinginspection

目視檢驗﹕visualinspection

機器檢驗﹕machineinspection

焊點質量﹕solderingjointquality

焊電缺陷﹕solderingjontdefect

錯焊﹕solderwrong

漏焊﹕solderskips

虛焊﹕pseudosoldering

冷焊﹕coldsoldering

橋焊﹕solderbridge

脫焊﹕opensoldering

焊點剝離﹕solderoff

不潤濕焊點﹕solderingnonwetting

錫珠﹕solderball

拉尖﹕icicle；solderprojection

孔洞﹕void

焊料爬越﹕solderwicking

過熱焊點﹕overheatedsolderconnection

不飽和焊點﹕insufficientsolderconnection

過量焊點﹕excesssolderconnection

助焊劑剩余﹕fluxresidue

焊料裂紋﹕soldercrazeing

焊角翹起﹕fillet-lifting；lift-off

AI:Auto-Insertion自動插件

AQL:acceptablequalitylevel允收水準

ATE:automatictestequipment自動測試

ATM:atmosphere氣壓

BGA:ballgridarray球形矩陣

CCD:chargecoupleddevice監視連接元件(攝影機)

CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具

COB:chip-on-board晶片直接貼附在電路板上

cps:centipoises(黏度單位)百分之一

CSB:chipscaleballgridarray晶片尺寸BGA

CSP:chipscalepackage晶片尺寸構裝

CTE:coefficientofthermalexpansion熱膨脹系數

DIP:dualin-linepackage