积体电路构装介绍.pptVIP

標準傳統積體電路封裝StandardICPackageAssemblyFlowWaferinTaping(Optional)Grinding(Optional)BackLASERMarkingMoldingDieCoating(Optional)WireBondCuringDieBondDieSawDe-taping(Optional)CuringPlatingTrimmingCuringTopMarkingFormingPackingDeliveryWaferMountO/STesting(Optional)Curing(Optional)標準傳統IC封裝製程傳統積體電路封裝流程ConventionalICPackageAssemblyFlow第一目視檢查(1stOptical)黏貼保護膠膜(WaferTaping)晶圓藍膜上片(WaferMount)撕膠膜(WaferDetaping)晶圓背面研磨(WaferBack-SideGrinding)100%WaferInspection第二目視檢查(2ndOptical)晶圓切割(WaferSawing)(DieingSaw)晶圓背面研磨(BackGrinding)晶圓切割(Dieing)晶圓入廠(Waferin)傳統IC封裝流程1(DieAttach)銲晶(EpoxyCuring)烘烤(WireBond)銲線LOC銲晶(LeadOnChip)(CoatingCuring)烘烤點膠(ChipCoating)封裝前(100%Pre-SealingInspection)(4thOptical)第四目視檢查(3rdOptical)第三目視檢查封裝前(100%Pre-SealingInspection)銲晶(DieBonding)銲線(WireBonding)點膠(ChipCoating)(Optional)傳統IC封裝流程2(Molding)封膠(PostCuring)烘烤(LaserMarking)背面蓋印塑料製餅預熱(CompoundPre-Heat)(SolderPlating)電鍍(Optional)(5thOptical)第五目視檢查(De-junk/De-flash)去膠去緯烘烤(InkIRCuring)(TopMarking)正面蓋印(Optional)(Molding)封膠(LaserMarking)背面蓋印(De-junk/De-flash)去膠去緯(SolderPlating)電鍍(TopMarking)正面蓋印傳統IC封裝流程3短開路測試(Open/ShortTesting)初貨前檢(OutgoingInspection)(Forming/Singulation)衝切彎成型腳外型測檢查(LeadInspection)(Optional)出貨(Shipping)(100%Inspection)(6thOptical)包裝(Packing)成型(Forming)測試(Testing)100%目檢外型測檢查(LeadInspection)包裝(Packing)出貨(Shipping)傳統IC封裝流程4球柵陣列積體電路封裝BGAICPackageAssemblyFlowWaferinTapingGrindingCuringMoldingWireBondPlasmaCleaningCuringDieBondDieSawDe-tapingSingulationBallMountCuringMarkingFluxCleanTestingPackingDeliveryWaferMount球柵陣列IC封裝製程捲帶式自動構裝TapeCarrierPackage(TCP)AssemblyFlow/TapeAutomatedBonding(TAB)LSI-WaferBumpingProbingDicingAdhesiveCopperFoilPolyimideBondingPatterningPlatingBumpingProcess晶片凸塊製程2.TapeProcess捲帶載體製程