焊线及焊线工艺介绍.pptVIP

WIREBOND

PROCESSINTRODUCTION

CONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT

封裝簡介晶片Die金線GoldWire導線架Leadfram

WaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKG

WireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)

GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLE

銲接條件HARDWELDINGPressure(Force)AmplifyFrequecyWeldingTime(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)

BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclamp

XYTableLinear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mm

W/HASSYchangeover·Fullyprogrammableindexertracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice

EagleBondingSystemBondingMethod?Thermosonic(TS)BQMMode?ConstantCurrent,Voltage,PowerandNormal(Programmable)LoopType?Normal,Low,SquareJXYResolution?0.2umZResolution(capillarytravellingmotion)?2.5umFinePitchCapability?35mmpitch@0.6milwireNo.ofBondingWires?upto1000ProgramStorage?1000programsonHardDiskMultimodeTransducerSystem?Programmableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)

EagleVisionSystemPatternRecognitionTime?70ms/pointPatternRecognitionAccuracy?+0.37umLeadLoca