时效时间对Sn-58Bi-xCe_Cu焊点组织及显微硬度的影响.pdfVIP

HotWorkingTechnology2017，Vo1．46，No．11

时效时间对Sn一58Bi-xCe／Cu焊点

组织及显微硬度的影响

宋兵兵杨莉，相积岑，徐刘峰，彭雪

f1．常熟理工学院汽车_T-程学院，江苏常熟215500；2．苏州大学机电工程学院，江苏苏州215000)

摘要：研究了时效时间对Sn一58BiC／u和Sn．58Bi一0．5Ce／Cu焊点组织和显微硬度的影响。结果表明：随着时效时

间增加，Sn一58BiC／u和Sn一58Bi一0．5CeC／u焊点组织逐渐粗化，界面IMC厚度不断增加；同一时效时间下，Sn一58Bi一

0．5CeC／u焊点的晶粒尺寸和界面1MC层厚度均低于Sn．58BiC／u焊点。焊点的显微硬度均随时效时间增加先增大后降

低．且Sn一58Bi一0．5Ce／Cu焊点的显微硬度均高于Sn一58Bi／Cu焊点。Ce颗粒的添加可有效抑制时效过程中焊点组织的粗

化及界面IMC层厚度的增加，从而获得较高的显微硬度。

关键词：时效时间；显微组织；金属间化合物层；显微硬度

DOI：10．141580．cnki．1001-3814．2017．11．012

中图分类号：TG425文献标识码：A文章编号：1001—3814(2017)11-0044．03

EffectsofAgingTimeonMicrostructureandMicrohardness

ofSn-58BiCe／CuSolderJoint

SONGBingbing，YANGLi，XIANGJichen，XULiufeng，PENGXue

(1．SchoolofAutomotiveEngineering，ChangshuInstituteofTechnology，Changshu215500，China；2．SchoolofMechanical

andElectricalEngineering，SuzhouUniversity，Suzhou215000，China)

Abstract：TheeffectsofagingtimeonthemicrostructureandmicrohardnessofSn一58Bi／CuandSn一58Bi一0．5Ce／Cu

solderjointsweresutdied．Theresultsshowthatwiththeincreaseofagingtime，themicrostructureofSn一58Bi／Cuand

Sn-58Bi一0．5Ce／Cusolderjointscoarsens，andtheIMClayerthicknessincreases．Underthesameagingtime，thegrainsizeand

IMClayerthicknessofSn．58Bi一0．5CeC／usolderiointarelowerthanthoseofSn．58Bi／Cusolderioint．Withtheincreaseof

agingtime，themicrohardnessofsolderjointsincreasesfirstlyandthendecreases，andthemicrohardnessofSn一58Bi一0．5Ce／Cu

solderjointishigherthanthatofSn一58Bi／Cusolderjoint．TheadditionofCeparticlescaneffectivelyinhibitthe

microstrucutrecoarseningofsolderjointandtheincreaseofIMClayerthicknessduringagingprocess，andhigher

microhardnessisobtained．

Keywords：agingtime；microstructure；intermetallicc