助焊剂ws-3543-wafer-flux-pds-98398-r3-1说明书.pdf

PRODUCTDATASHEET

WS-3543

WaferFlux

Introduction

WaferFluxWS-3543isalow-viscositysemiconductor-grade

flux,specificallyoptimizedforuniform,oxide-freesolderbump

formationacrosswafersupto300mm(12inches)indiameter,

withoutsolderthieving.WS-3543washesoffeasilyandleaves

zeroresidues,evenafterrepeatedapplication/reflow/cleaning

cycles.

Features

•Water-soluble

•Viscositysuitablefor150–300mmwafers

•Noresidue

•Halogen-free—nointentionallyadded(NIA)halogens

•Promotesuniformsolderbumpformation

•SuitableforSnPbandPb-freesolderapplications

Properties

ValueTestMethod

J-STD-004

FluxType

ORM0(IPC-TM-650:

Classification2.3.32and2.3.33)Forsprayapplications,theequipmentfluxstoragetankshould

Cannon-Fenskeholdenoughfluxforone8-hourshift.Additionalfluxremaining

TypicalViscosity91cStviscometerinthetankmayexpire(potlife8hoursatroomtemperature)if

leftforaprolongedamountoftime.Sprayequipmentshouldalso

SIR(Ohms,postPass(108afterJ-STD-004becleanedfrequentlytoensurethehighestlevelofpuritywith

cleaning)7days@85°C(IPC-TM-650:thisoranyotherflux.

and85%RH)2.6.33IPC-B-24)

TypicalAcidValue56mgKOH/gTitrationCleaning

SpecificGravity0.988g/ccJ-STD-004B

WS-3543isdesignedtobereadilycleanablewithDIwater,or

Co