助焊剂ws-3518-wafer-flux-pds-98431-r3-1说明书.pdf

PRODUCTDATASHEET

WS-3518

WaferFlux

Introduction

WaferFluxWS-3518isalowviscositysemiconductor-gradeflux,

specificallyoptimizedforuniform,oxide-freesolderbumpformation

acrosswafersupto300mm(12inches)indiameter,withoutsolder

thieving.WS-3518washesoffeasilyandleaveszeroresidues,even

afterrepeatedapplication/reflow/cleaningcycles.

Features

•Water-soluble

•Viscositysuitablefor150–300mmwafers

•Noresidue

•Halogen-free—nointentionallyadded(NIA)halogens

•Promotesuniformsolderbumpformation

•SuitableforSnPbandPb-freesolderapplications

Properties

ValueTestMethod

J-STD-004

FluxType

ORM0(IPC-TM-650:

Classification

2.3.32and2.3.33)

TypicalViscosity96cStCannon-FenskeviscometerForsprayapplications,theequipmentfluxstoragetankshould

8holdenoughfluxforone8-hourshift.Additionalfluxremaining

Pass(10afterJ-STD-004

SIR(Ohms,7days@85°C(IPC-TM-650:inthetankmayexpire(potlife8hoursatroomtemperature)if

post-cleaning)

and85%RH)2.6.33IPC-B-24)leftforaprolongedamountoftime.Sprayequipmentshouldalso

TypicalAcidValue61mgKOH/gTitrationbecleanedfrequentlytoensurethehighestlevelofpuritywith

thisoranyotherflux.

SpecificGravity0.987g/ccJ-STD-004B

ColorDeepamberVisualCleaning

toyellow