KDP晶体切削机理的实验研究.docVIP

  KDP 晶体切削机理的实验研究# 张飞虎，张超，付鹏强* （哈尔滨工业大学机电工程学院，哈尔滨 150001） 5 10 15 20 25 30 35 40 摘要：KDP 晶体是一种用于惯性约束核聚变中重要的非线性光学材料。传统光学研抛方法 已不适用于加工 KDP 晶体，而单点金刚石飞刀切削由于其物理化学特性很适用于加工 KDP 晶体。本文提出一种观察 KDP 切屑来研究切削机理的方法。用具有圆弧刃的单点金刚石刀 具切削 KDP 晶体，用光学显微镜可以观察到切屑中的塑性变形，并且在切屑宽度方向上可 以看到明显的脆性断裂到塑性变形之间的转变。从观测切屑形貌入手，研究其在塑性域去除 的极限厚度，并研究与之相对应的刀尖圆弧半径、工作台进给量和切削深度的选择范围，以 及在不同晶面沿不同晶向上切削时的塑性切削极限厚度和对应的已加工表面粗糙度值，建立 工件表面质量-切屑形貌特征-加工工艺参数之间的关系，指导切削工艺路线的制定。 关键词：KDP 晶体；切削机理；脆塑转变；切屑形态 中图分类号：TG501.1 Experimental Investigation of Cutting Mechanism of KDP Crystal ZHANG Feihu, ZHANG Chao, FU Pengqiang (School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001) Abstract: The Potassium Dihydrogen Phosphate(KDP) crystal is used as key non-linear optical material in Inertial Confinement Fusion(ICF). Traditional photoprocessing methods such as grinding and polishing are not suitable and Single Point Diamond Fly Cutting is adopted because of its special physicochemical characteristics. A method of observing KDP chips to study cutting mechanics has been presented in this paper. The KDP crystal was processed by a mono diamond tool with arc-nose, and plastic deformation can be found in the inside chip by optical microscope, also apparent transition of brittle fracture to plastic deformation can be found along the width direction of chips. By this method, chips in different cutting parameters were compared to study the relationship between critical thickness of ductile removal and cutting parameters like cutting depth and feedrate. Cutting experiments along different direction on different crystal planes were operated to research anisotropic characteristic of KDP crystal. Key words: KDP crystal;cutting mechanism;brittle-ductile transition; chip morphology 0 引言 KDP 晶体是一种优秀的非线性光学元件，但其质软脆、易潮解等特性为超精密加工带 来困难，传统的光学研抛等加工方式不再适用，只能采用超精密单点金刚石飞切的方式进行 超精密加工[1,2]。由于光学元件对表面质量的超高要求，除了机床需要保证足够的加工精度 外，晶体的切削去除机理也是需要深入研究的。 国内外学者对于脆性材料各向异性的加工机理进行了深入的研究，但是其模型均是针对 硬脆材料，对 KDP 这种软脆材料的研究较少。Blackey[3]通过对脆性光学材料单晶锗的一系 列车削实验研究