界面形貌对热障涂层界面残余应力影响的数值模拟.pdfVIP

　　界面形貌对热障涂层界面残余应力影响的数值模拟 计算机应用 ( ) 王 　洪 ,张 　坤 ,陈光南 中科院力学研究所 表面改性实验室 ,北京 　100080 摘要 :利用有限元方法 ,对热障涂层热循环降温过程中产生的残余应力进行了数值模拟 ,研究了有尖点和无尖点正弦波形微坑 以及矩形微坑对界面残余应力的影响 。结果表明 ,微坑形状不同 ,界面上残余应力的大小 、性质与分布也不同;微坑的形状变化 和尖点的出现 ,将会使该处的应力发生突变 ,不利于增强界面结合强度 。因此 ,从对热障涂层界面残余应力的影响角度看 ,无尖 点的正弦波形微坑既优于有尖点微坑也优于矩形微坑 。 关键词 :界面形貌 ;热障涂层 ;有限元方法 ;数值模拟 中图分类号 :TG174 　　文献标识码 :A 　　文章编号 2001) Numerical Simulation of Interfacial Residual Stresses in Thermal Barrier Coatings Induced by Interface Topography WAN G Hong ,ZHAN G Kun ,CHEN Guangnan (Laboratory of Surface Modification ,Institute of Mechanics ,Chinese Academy of Science ,Beijing 100080 ,China) Abstract :The residual stresses in t hermal barrier coatings during cooling of heat cycles were numerically simulated by finite element met hod in t his p ap er ,wit h an attempt to understand t he influences of interface topograp hy ,rectangle micropit ,sinusoid wit h tip and wit hout tip ,on interfacial residual stresses distribution . It shows t hat ,interfacial residual stress distribution is varied wit h t he shap e of micropit and t he variation of micropit and app earance of tip will cause t he sudden change of stresses which is bad to interface bonding. On t he opinion of t he influences on t he interfacial residual stressed in t hermal barrier coatings ,t he sinusoid micropit wit hout tip is bet ter t han bot h microtip sinusoid wit h tip and rectangle . Key words :interface topograp hy ;t hermal barrier coatings ;finite element met hod ;numerical simulation 1 　引言 方法因难以精确控制所制造的界面形貌和粗糙度 ,其强化效 果有 限。为 此