NPI IE 工作手册.pptVIP

MOI Design Guide Line 7. LQC A.All safety requirements which are not cover under functional test shall be 100% inspected. a.Insulator shall not missing and location must be correct. b.Cable tie are present. - Photo c.Ferrite bead are present. - Photo d.Wire dressing / twisting must be correct. - Photo e.Bulk components glue location must be correct, eg. Bulk cap, transformer, choke,…etc. - Photo f.Heat shrink tubes are present.- Photo g.100% check pcb sit within lancing ( For old design only ) – Photo MOI Design Guide Line B. a. Case main panel must be scratches free b.Inspected units must be marked according to standard marking system. c.Sleeve components must be 100% ensure correct value ( test station detectable or visual ) or polarity. d.All label must be in place, correct orientation, no damage, bubbles or scratches. 回到第一頁 * 回到第一頁 * NPI IE 工作手冊 Prepared by:Bravechi Date : 2003/2/25 Checked by:Sky Hu NPI IE工作手冊目錄 一. 新機種制作流程圖 二. 試產各Stage 完成事項 三. Release meeting 四. 相關參考資料 4.1 Kick off meeting check list 4.3 New Project History tracking check list 4.2 Release Meeting Check List 4.4 All Data lead time standard guideline 4.5 MOI Design Guide Line NPI IE工作手冊 1 .新機種制做流程圖 C . Pilot Run Stage 1.確認上一Stage所有Open Issue 狀況,并依相關資料與相關部門做產前FMEA,并將 結果PASS給相關部門提前對策.,Pilot Run Stage 須有Yellow Book方能生產, All Open Issue 必須Close , 否則須與P/T及PM達成協議,確定暫時對策及永久對策. 2. 依最新資料完成MOI( MOI須依客戶要求及附件MOI Design guide line完成),并確 認所有治具均已完成及符合設計需求. 3. HI三個工作日前,將分階料表提供給MC及AI.有任何變更信息時, 須及時知會 QC,MC,AI,MFG 等相關單位并Follow Up.同時依Final P/L 分階建BOM , BOM 中須 將Mixing Source中的不良Source刪除,如未做到Mixing Run的Source須與采購及PM確 認,安排重做Mixing Source. 4. HI三個工作日前召開Open Meeting確認生產Schedule及出貨明細狀況,并確認制程中 所需的治具及設備是否完成.同時通知MP IE參與Pilot Run Stage . 5. 處理生