热耦合效应研究.docVIP

Cover Page Title: Thermal Coupling Effects and Thermal Resistance Matrix Research of Multi-Heat Sources MCM Authors: Ji Cheng1,2,Xiaoqi He2,Hengwei Bao3,Xunping Li2,Bin Zhou2,Lianrong Zhou3,Zhangchao Wang3 Authors Name (of Affiliation: Department Name, Name of Organization, City, Country) 1School of Materials and Energy, Guangdong University of Technology, Guangzhou, China 2Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China 3East China Research Institute of Microelectronic, Hefei, China Corresponding author: Corresponding author name: Ji Cheng, Xiaoqi He, E-mail: ccchengji@, hxq@, Phone: 020Abstract: High density assembly results in evident thermal coupling effect between chips in MCM. Junction temperature is decided by self-heating effect and thermal coupling effect. It can be effectively calculated by the thermal resistance matrix. This paper focuses on thermal coupling effect and presents heat conduction routes and thermal resistance model of three different MCM (lateral-chip, stacked-chip and lateral-and-stacked chip). Based on linear superposition theory, the thermal resistance matrix is established by FEA simulation, and the model of calculating junction temperature is obtained by thermal resistance matrix. Then the model is verified by infrared thermal imaging experiment. The relative error between them is less than 2% Category: Design, Test and Assessment for Reliability, Reliability simulation technology (19) Presentation mode: poster Thermal Coupling Effects and Thermal Resistance Matrix Research of Multi-Heat Sources MCM Ji Cheng1,2,a, Xiaoqi He1,b, Xunping Li1, Bin Zhou1 1Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China 2School of Materials and Energy, Guangdong University of Technology, Guangzhou, China accchengji@, bhxq@ Hengwei Bao3,Lianrong Zhou3,Zhangchao Wang3 3East China Research Institute