聚酰亚胺薄膜和尺寸稳定及其制备工艺.docVIP

United States Patent 4,725,484 Kumagawa , ? et al. February 16, 1988 Dimensionally stable polyimide film and process for preparation thereof Abstract A dimensionally stable polyimide film and processes for the preparation thereof. The polyimide film is composed of an aromatic polyimide obtained from a solution of a polymer formed by polymerization of a biphenyl-tetracarboxylic acid and a phenylene diamine, wherein the average linear expansion coefficient of the polyimide film in the temperature range of from 50.degree. C. to 300.degree. C. is 0.1.times.10.sup.-5 to 2.5.times.10.sup.-5 cm/cm..degree.C., the ratio of the linear expansion coefficient in the machine direction of the film to the linear expansion coefficient in the transverse direction of the film is in the range of from 1/5 to 4, and the thermal dimension stability expressed by the ratio of the change of the size of the film at normal temperature after the heat treatment where the temperature is elevated to 400.degree. C. from normal temperature and the film is maintained at 400.degree. C. for 2 hours is less than 0.3%. Inventors: Kumagawa; Kiyoshi (Ube, JP), Kuniyasu; Kenji (Ube, JP), Nishino; Toshiyuki (Ube, JP), Matsui; Yuji (Ube, JP) Assignee: Ube Industries, Ltd. (Yamaguchi, JP) Appl. No.: 06/864,299 Filed: May 16, 1986 Foreign Application Priority Data May 17, 1985 [JP] 60-103674 May 17, 1985 [JP] 60-103675 Current U.S. Class: 428/220 ; 428/473.5; 428/901; 528/353 Current International Class: C08J 5/18?; B32B 027/28?(); B32B 027/34?(); C08G 069/26?() Field of Search: 428/473.5,220,901 528/353 264/212 References Cited [Referenced By] Foreign Patent Documents 007805 Jan., 1980 JP 0007805 Jan., 1980 JP Primary Examiner: Herbert; Thomas J. Attorney, Agent or Firm: Burgess, Ryan Wayne Claims We claim:1. A dimensionally stable polyimide film composed of an aromatic polyimide obtained from a solution of a polymer formed b