(热阻)电子封装的简化热模型研究.pdfVIP

第 29 卷 　第 3 期 电 子 器 件 Vol . 29 　N o . 3 2006 年 9 月 Chinese J our nal of Elect r on Devices Sep . 2006 Study of Compact Thermal Model s f or Electronic Packages Z H A N G D ong , F U Guicui ( D ep t. of S y s tem Eng i neeri ng of Eng i neeri ng Technology , B eij i ng Uni vers ity of A eronaut ics an d A s t ronaut ics , B eij i ng 100083 , Chi na ) Abstract :The power di ssip ation and heat in a unit of elect ronic p ackage s an d equip ment s increa se cea sele ss ly wit h t he rapidly develop ment of IC. The cooling of elect ronic sy st em s need s to be care and p redict s in de sign p ha se by t her mal simulation . IC p ackage i s t he smalle st unit in elect ro nic sy st em s , co mp act t her mal mo del s of IC p ackage s influence t he sp eed and accuracy of t her mal analy si s direct ly . The p ap er p re s ent s mainly t he generation of t he st eadyst at e co mp act t her mal mo del s of single chip p ackage s , int ro duce s t he st r uct ure of mo del s f ro m single t her mal re si st ance mo del to pop ular D EL P H I mo del of B CI at p re sent an d e sp ecially analyze t wore si st ance mo del an d D EL P H I mo del for t he met ho ds and p roce ss of mo del gen erat ed . Key words :co mp act t her mal mo del ; t her mal re si st ance ; t her mal analy si s ; p ackage EEACC :0710J 电子封装的简化热模型研究 张 　栋 ,付桂翠 (北京航空航天大学 工程系统工程系 , 北京 100083) 摘 　要 :集成电路的飞速发展使得从封装到电子设备的单位体积功耗和发热量不断增加 。电子系统散热问题需要在设计阶 段就通过热仿真予以充分考虑和预测 。电子封装作为电子系统的最小组成部分 ,其简化模型的优劣直接影响电子系统热分 析的速度和准确性 。本文主要讨论单芯片封装稳态简化热模型的建立 。先后介绍了从最简单的单热阻模型到 目前广为关注 的边界条件独立的D EL P H I 简化模型的结构 。其中着重分析了两热阻模型和 D EL P H I 模型的建模方法及过程 。 关键词 :简化热模型 ;热阻;热分