覆晶技术(Flip-Chip)介绍.pdfVIP

Available Flip Chip Tutorials Tutorial 1. Introduction to Flip Chip Tutorial 2. Solder Bump Flip Chip Tutorial 3. Stud Bump Flip Chip Tutorial 4. Polymer Bump Flip Chip Tutorial 5. Anisotropic Conductive Film (ACF)Flip Chip Tutorial 6. A Brief History of Flipped Chips Tutorial 7. Electroless Nickel-Gold Flip Chip Tutorial 8. Reworking Underfilled Flip Chip Tutorial 9. Thermosonic Flip Chip Assembly Tutorial 10. Flip Chip Interconnection for Detector Arrays Tutorial 11. Under Bump Metallization (UBM) Tutorial 12. Solder Bumping Step by Step Tutorial 14. Bonding Edge Emitting Laser Diodes Using Gold/Tin Preforms Tutorial 15. Substrates for Flip Chip Tutorial 16. Packaging, Handling, and Storing of Solder Spheres Tutorial 17. SOC, SOP, and WLSCP Tutorial 18. Fluxing for Flip Chip Tutorial 20. Causes of Misalignment Tutorial 21. Probing Bumped Flip Chips Tutorial 22. Controlling Stress in Thin Films Tutorial 23. Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies Tutorial 24. Gold Stud Bump Applications Tutorial 25. Low Temperature Flip Chip for Flexible Displays Tutorial 26. The Coming of Copper UBM Tutorial 27. Shaping Gold Ball Bumps Tutorial 28. Copper Bumps for Flip Chip Assembly Tutorial 29. Micro-Posts: Tall, Slender, Stud Bumps. Tutorial 30. Measuring thin films by spectral reflectance, Part 1 Tutorial 31. Wafer level hermetic cavity chip scale packages for RF Tutorial 32. Gold Stud Bumping - the Other Flip-Chip Process Tutorial 33. Conductive Polymer Assembly of High Pin Count Flip Chip Tutorial 34. Sputtered nickel UBM for lead-free solder bumping Tutorial 35. Measuring thin films by spectral reflectance, Part 2 Tutorial 36. MEMS Special Packaging Needs Tutorial 37. Too much gold can be a bad thing. Tutorial 38. Evaporated Indium Bumps for Flip Chip Tutorial 39. Electromigration and Thermomigration in Flip Chip Solder Joints Tutorial 40. Nano-embossing reaches production.