工艺条件对塑料低温化学镀铜影响.pdfVIP

O4 工艺条件对塑料低温化学镀铜的影响 王喜然1,2 李国芝3 (1. 河南科技大学材料科学与工程学院, 河南洛阳 471003； 2. 河南省有色金属材料科学与加工技术重点实验室, 河南洛阳 471003； 3. 河南科技大学化工与制药学院, 河南洛阳 471003) 摘 要：本文研究了工艺条件对塑料化学镀铜的影响，考察了工艺条件温度、PH 值、施镀时间对塑料化学镀铜的影响，并 通过扫描电镜和能谱分析对镀层的形貌及成分做了研究。结果发现，在镀液成分为硫酸铜 3g/L、甲醛（36%-40% ）10g/L、酒石 酸钾钠 25g/L 、氢氧化钠 7g/L 的条件下，最佳工艺条件是，镀液温度 50℃，pH 为 12，施镀时间为45～50min 。在优化工艺条件 下，镀层沉积速度最大可达 13.728μm /h 。优化工艺条件下，镀层表观光亮，均匀，无起泡脱皮现象，与基体结合力好。能谱仪 扫描结果表明，镀层成分为单一的铜。 关键词：化学镀铜，塑料，工艺条件，低温 Effect of Process Conditions on Low Temperature Electroless-Cu-plating on Plastic WANG Xiran1,2 LI Guozhi3 (1. Materials Science and Engineering, Henan university of science technology, Luoyang 471003, China; 2. Henan key laboratory of non-ferrous metal materials science and processing, Luoyang 471003, China 3. School of Chemical Engineering Pharmaceutics; Henan university of science technology, Luoyang 471003, China ) Abstract: The effects of process conditions on low temperature electroless copper plating on plastic is investigated in this paper. The inflences of the temperature, PH value and plating time on the plating copper quality were discussed. The components and surface morphology of the coating was studied by using SEM and EDS.The results show that the optimum operating codition is temperature being 50℃, the optimum PH value being 12 and plating time being 45～ 50min in the plating solution, which is CuSO43g/L, methanal 10g/L, potassium sodium tartrate 25g/L and NaOH7g/L. Under the optimal technical conditions, the deposits is smooth and Uniformity, and has no the bubbling and peeling. The adhesion between the deposits and the substract is better, The analyses of energy disperse X-ray indicated that the single content is copper in the