BGA封装锡球制备技术研究.pdfVIP

10 Vol.24 No.10 第 期 电 子 元 件 与 材 料 2005 10 Oct. 2005 年 月 ELECTRONIC COMPONENTS MATERIALS 综 述 REVIEW BGA 封装锡球制备技术研究 高德云，夏志东，雷永平，史耀武 （北京工业大学材料科学与工程学院，北京 100022） 摘要: 综合介绍了 BGA 封装使用锡球常用制造方法，分析了研究较多的均匀颗粒成型技术的原理。用均匀液滴 法制备的 BGA 锡球颗粒具有真圆度高，表面质量好，颗粒粒度均匀等特点，能直接得到满足使用要求的锡球，生产 效率远胜于传统生产技术。重点介绍均匀颗粒成型的几种实现方法及特点，其中 AC-DC 雾化法具有实现方式简单， 成型优异的特点。 关键词:电子技术；锡球；综述；BGA；制备技术；均匀颗粒 中图分类号: TG42 文献标识码:A 文章编号:1001-2028 （2005 ）10-0056-05 Research on Technology of Fabricating Solder Ball for BGA Packaging GAO De-yun, XIA Zhi-dong, LEI Yong-ping, SHI Yao-wu (School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China) Abstract: Fabricating methods often used for solder ball in the BGA package were reviewed. UDS (uniform droplet spray), which is widely investigated was analyzed. UDS fabricated particles are with characteristics of good roundness, better exterior quality and monodispersity, and the quality is better than ones produced by traditional technologies, particularly in productivity. A few of UDS methods and their feature are particularly pointed out. Among them the AC-DC spraying method is with fabricating simplification and high shaping quality. Key words: electronic technology; solder ball; review; BGA; fabricating method; uniform particle BGA 封装是采用锡球来代替 IC 元件封装结构中