PCB电镀铜镀液中铁离子对镀层质量影响的研究.pdfVIP

孔化与电镀Hole and 2014秋季国际PCB技术／信息论坛 Processing PCB电镀铜镀液中铁离子 对镀层质量的影响研究 Code：A-106 Paper 陈国琴王种 王守绪何为 (电子科技大学应用化学系四Jll成都610054) 肖定军 谭泽 (广东光华科技股份有限公司广东汕头515061) _鬻类瓣一 Theinfluenceofironionsonthe COatingquality inPCB bath copperplating Yu CHEN WANGWANGShou-xuHEWeiXTAO TANZe Guo—qin Ding-jun Theinternational havebeenusedironionasanew for Abstract leadingpositionsuppliers additive cooper andhavebeen theironionshowedeffectintheactualPCB plating implementedpatentprotection，and good copper bath．IthasbeenstudiedthemechanismofFe2+／Fe3+inthe solutionandthe oftheferric／ plating plating impact onthebehaviorof ferrous(Fe3+／Fe2+)redoxcouple polyethyleneglycol(PEG)and hasbeen hasbeenconcemedaboutthe (SPS)duringcopperelectrodepositioninvestigated．Howevertheindustry iron affectthe ofthe the ionwill studiesinfluenceofFe2+／FeHredox propertiescoating．Thispapermainly couple onthe ofthe resultsshowthatthethicknessof isinhibitedandthe propertycoating，The copper throwingpower inthe ofFe2+／Fe”redox Can the is minim