化学镀法制备镀银云母.pdfVIP

化学镀法制备镀银云母 李祝，李红*，洪旭城，张志伟 （广东工业大学轻工化工学院，广东广州 510006 ） 摘要：采用敏化–活化两步法对云母粉进行预处理后再化学镀银。研究了镀液pH 、银含量和云母粉与AgNO 质量比对镀银云母粉 3 导电性的影响。通过红外光谱仪和X 射线衍射仪表征了镀银云母粉的组织结构。通过表面形貌分析，研究了粗化预处理对云母粉 化学镀银效果的影响。结果表明，粗化可提高粉体表面的粗糙度，使后续银镀层更致密。当AgNO3 投加量为 15 g/L，云母粉与AgNO3 质量比为2.5 ∶1，pH 为12 时，银沉积率最高，镀银云母粉的表面形貌和导电性最好(体积电阻率约0.088 Ω·cm)。化学镀银云母 粉有望替代部分银粉作为导电填料，并在涂料或塑料等高分子材料中应用。 关键词：云母；化学镀银；粗化；导电填料；电阻率 中图分类号：TQ153.16 文献标志码：A 文章编号：1004 – 227X (2015) 09 – 0491 – 05 Preparation of silver-coated mica by electroless sliver plating // LI Zhu, LI Hong*, HONG Xu-cheng, ZHANG Zhi-wei Abstract: Mica powder was subjected to electroless silver plating after pretreatment by a two-step method comprising sensitization and activation. The influences of pH, silver content, and mass ratio of mica powder to AgNO3 of plating bath on the conductivity of electroless silver plated mica powder were studied. The structure of electroless silver plated mica powder was characterized using infrared spectrometer and X-ray diffractometer. The effect of roughening pretreatment on electroless silver plating was studied by surface morphology analysis. The results showed that roughening improves the roughness of powder and increases the density of silver coating prepared thereon. Under the conditions of a dosage of AgNO3 15 g/L, a mass ratio of mica powder to AgNO3 2.5:1, and pH 12, the deposition rate of silver is the highest, and the electroless silver plated mica powder has the best surface morphology and lowest conductivity (volume resistivity 0.088 Ω·cm). Electroless silver plated mica powder is a promising alternative to part of silver powder to serve as conductive filler and apply to coatings, plastics, and other high-molecular-weight polymer materials. Keywords: mica; electroless silv