超薄不锈钢基板化学机械抛光运动机理分析.pdfVIP

第5期 组合机床与 自动化加工技术 No.5 2015 年5 月 Modular Machine Tool Automatic Manufacturing Technique May2015 文章编号:1001-2265(2015)05-0027-04　 　 　 　 DOI:10.13462/ ki.mmtamt.2015.05.008 超薄不锈钢基板化学机械抛光运动机理分析∗ 杨向东,魏　 昕,谢小柱,胡　 伟 (广东工业大学机电工程学院,广州　 510006) 摘要:从运动学角度出发,根据超薄不锈钢基板与抛光垫化学机械抛光过程中的运动关系,通过分析 磨粒在不锈钢基板表面的运动轨迹,揭示了抛光垫和不锈钢基板的转速和转向等参数对超薄不锈钢 基板表面材料去除率和非均匀性的影响。 分析结果表明:超薄不锈钢基板与抛光垫转速近似相等、 转向相同时可获得最佳的材料去除率及材料去除非均匀性。 研究结果为CMP机床设计、CMP运动 参数的自动控制和进一步理解CMP 的材料去除机理提供了技术和理论依据。 关键词:超薄不锈钢基板;化学机械抛光;材料去除机理;材料去除率;非均匀性 中图分类号:TH122;TG506　 　 　 文献标识码:A An Analysis of Kinematic Mechanism on Ultra-thin Stainless Steel Substrate in Chemical Mechanical Polishing YANG Xiang-dong,WEI Xin,XIE Xiao-zhu,HU Wei (Faculty of Electromechanical Engineering,Guangdong University of Technology,Guangzhou510006,China) Abstract:In thispaper the kinematic relationshipsbetween ultra-thin stainless steel substrate with the polis- hing pad in the chemical mechanical polishingprocessare calculated.The parametersof the rotational speed of the polishingpadandthe stainlesssteel substrate simpacttotheultra-thin stainlesssteel surfacesmaterial removal rate and non-uniformity are revealed by analyzing the abrasive grainsin the surface of the stainless steel substrate trajectory. The analysisresults show that:when the ultra-thin stainless steel substrate and the polishingpad speedare approximately equalanditssteering directionsarethe same can get thebest material material removalrate and matericalremoval uniformity.The analyticalresultsprovide technical andtheoreti- cal guide to design the CMP equipments,the automatic control of kinematic parameters in CMP and further understanding of the material rem