硬脆材料超声振动磨削的试验研究.pdf

第29 卷第2 期 辽宁工程技术大学学报（自然科学版） 2010 年4 月 Vol.29 No.2 Journal of Liaoning Technical University （Natural Science ） Apr . 2010 文章编号：1008-0562(2010)02-0287-03 硬脆材料超声振动磨削的试验研究 王 军，张 淳 （燕山大学机械工程学院, 河北 秦皇岛 066004 ） 摘 要：针对硬脆材料磨削效率低的难题，研究了硅片的超声振动磨削方法。进行了超声振动磨削与普通磨削的 对比试验，研究了磨削参数变化对磨削力及表面粗糙度的影响，根据试验结果，分析了硬脆材料的脆性与塑性去 除机理。研究证明：超声振动磨削硬脆材料虽然使粗糙度略有变大，但能够明显提高加工效率，降低加工成本。 综合考虑精度与效率指标，超声振动磨削是一种实用的硬脆材料加工技术。 关键词：硬脆材料；硅片；超声振动磨削；粗糙度 中图分类号： TH 145 文献标识码： A Experimental study on ultrasonic grinding of hard and brittle materials WANG Jun ，ZHANG Chun （College of Mechanical Engineering, Yanshan University，Qinhuangdao 066004,China ） Abstract: In order to investigate the low efficiency problem in grinding hard-brittle materials, an ultrasonic vibration grinding method of silicon wafer was proposed. In a comparative experiment on ultrasonic vibration grinding and traditional grinding, the impact of varying grinding parameters on grinding force and surface roughness was tested. Also, the mechanism of removing plastic and brittle properties of hard-brittle materials was analyzed based on the testing results. The study demonstrates that the grinding efficiency for hard-brittle materials can be improved using ultrasonic vibration grinding method although the roughness is slightly high. It is a practical technology for processing hard-brittle materials. Key words: hard and brittle materials; silicon wafer; ultrasonic vibration grinding; roughness 0 引 言 主轴 近些年，硬脆材料（如工程陶瓷、硅片等）的