FPC操作注意事项.docVIP

FPC操作注意事项 Reprinted from Electronic Packaging Production, October 1993CLEANING AND HANDLING OF FLEX CIRCUITSProper handling and cleaning of flex circuits will result in higher yield and quality, and in customer satisfactionBy Jack LexinAs the demands for miniaturization, electromechanical performance, environmental operation and reliability increase, the processing of flexible circuits becomes more difficult and process control more critical. Fine lines and spacing, and minimal thickness of dielectric and conductors demand a narrow margin of error. Furthermore, as the thickness of the flexible circuit decreases, the instability of the plastic dielectric increases. Materials of construction The majority of flex circuits are constructed from a combination of dielectric materials with varying physical, electrical, mechanical, chemical and thermal properties. These differences are illustrated through a comparison of flexible circuits (polyimide with a modified acrylic adhesive system) and rigid boards (glass/epoxy FR-4 or G-10). Considering the electrical properties, flex circuits have a 20 to 30 percent lower dielectric constant than rigid boards, which allows for thinner construction and better electrical isolation. The dielectric strength is as much as two times greater than that of epoxy boards. Flex circuits can bend both statically (one time bend for fit or assembly) and dynamically (disk drive, etc.). Multilayer rigid/flex greater than 20 layers can be designed and fabricated to bend around obstructions or to conform to an area. Thinner dynamic applications of shielded flex (emulating coaxial cable) can oscillate and flex in the tens of millions of cycles. Polyimide has excellent chemical resistivity; however, the adhesive system does not. The adhesiveless systems have poor bond strength after processing, making them functionally less desirable. The flex is more sensitive to alkaline environments, unlike the epoxies that can easily