Analysis of thermoelectric cooler performance for high power electronic packages.pdfVIP

Applied Thermal Engineering 30 2010 561–568 Contents lists available at ScienceDirect Applied Thermal Engineering journal home Analysis of thermoelectric cooler performance for high power electronic packages H.Y. Zhang *, Y.C. Mui, M. Tarin Advanced Micro Devices Singapore Pte. Ltd., Singapore a r t i c l e i n f o a b s t r a c t Article history: In this paper, an analysis of thermoelectric cooler TEC performance is conducted for high power elec- Received 14 September 2009 tronic packages such as processors. Based on the TEC module parameters, two sets of analytical solutions Accepted 30 October 2009 for TECs in system constraints are derived for the junction temperature T at a ?xed cooling power Q , and j c Available online 5 November 2009 for Q at a ?xed T , respectively. As against the iterative procedure often reported in literature, the major c j advantage of the present analytical method lies in the fact that the solutions can be obtained without Keywords: resorting to the pellet thermoelectric parameters and geometric details. Two cooling scenarios, the pro- Thermoelectric cooler TEC cessor test and the processor cooling under end-user conditions, are analyzed based on the present anal- Analytical solution ysis models for two commercial TECs with high cooling power capacities nominal. Analytical results Electronic cooling Optimization show that signi?cant thermal enhancements are achievable based on optimized currents and cooling Module parameter con?gurations. The validation of the present analysis is also conducted through experimental measure- ments and comparison with previous solutions. 2009 Elsevier Ltd. All rights reserved. 1. Introduction In the design and development of TEC apparatus, it is crucial to establish effective methodology to determine and optimize the TEC High power electronic packages like processors have posed performance within the cooling system constra