二氧化硅复合薄膜的热物性及其影响因素.pdfVIP

23 6 Vol.23 No.6 2 0 0 9 Æ 12 CHINESE JOURNAL OF MATERIALS RESEARCH December 2 0 0 9 / ∗ 1 1,2 1 2 1 1. 200050 2. 200240 / (DSC) (PI) PI/SiO2 , . PI/SiO2 SiO2 . , PI PI/SiO2 Æ, . PI SiO2 Æ PI , , PI . , , , PI/SiO2 TB332 1005-3093(2009)06-0587-05 Thermophysical properties and influencing factors of polyimide/silica composite films YANG Liping1 CAI An1,2 LUO Caiyun1 CHEN Jiangping2 XI Tonggeng1∗∗ 1.Shanghai Institute of Ceramics, Chinese Academy of Sciences (SICCAS), Shanghai 200050 2.Institute of Refrigeration and Cryogenics, Shanghai Jiao Tong University, Shanghai 200240 * Supported by National Nature Science Foundtion of China No Manuscript received March 17, 2009; in revised form August 21, 2009. **To whom correspondence should be addressed, Tel:(021 E–mail:xtg@mail.sic.ac.cn ABSTRACT Thermal diffusivities, thermal conductivities, and specific heats of PI film and PI/SiO2 composite film at different temperatures were measured by laser flash method and differential scanning calorimeter(DSC). The light transmission problem of thin films in the procession of testing thermal dif- fusivity by laser flash method was solved effectively. The influences of temperature and silica content on thermophysical properties of PI/SiO2 composite films were investigated. The results showed that thermal diffusivities of PI and PI/SiO2 decreased, and specific heats and thermal conductivities increased with increasing temperature. The addition of the