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Interconnection Technology
In Electronic Packaging
(Chapter 1. Fundamentals of micro-/nano-joining)
Hongjun JI Ph.D/Assistant Prof.
School of Materials Science and Engineering
Advanced Bonding Interconnection Technology By Hongjun JI Email:jhj7005@hit.edu.cn September 15,
Key technologies in EP
• Micro-joining technology
– Assembling process and fabrication technology for
materials and components that is precise-combined/bonded
mechanically and electrically.
• Applications
– For assembling and fabrication of ultra small sized machine
part, electronic components
• Micro valve, ultra small sized motor, LCD module…
– Required precision control in micro-order
• Fine wire bonding, flip-chip packaging, thin film seam…
2
Advanced Bonding Interconnection Technology By Hongjun JI Email:jhj7005@hit.edu.cn September 15,
Contents
• Fundamentals of microjoining
– Solid state bonding mechanism
– Soldering and brazing mechanism
– Fusion microjoining
– Simulation
• Techniques for microjoining and nanojoining
– Wire bonding techniques in electronics
– Solid state diffusion bonding
– Soldering and brazing
– Laser and electron beam microwelding
– Resistance microwelding
– Nanojoining
• Materials cases and applications
– Shape memory alloy, superconductor, SOFC, ceramics, plastics
3
Advanced Bonding Interconnection Technology By Hongjun JI Email:jhj7005@hit.edu.cn September 15
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