《Chapter1_Fundamentals_of_micro-nano-joining》.pdf

Interconnection Technology In Electronic Packaging (Chapter 1. Fundamentals of micro-/nano-joining) Hongjun JI Ph.D/Assistant Prof. School of Materials Science and Engineering Advanced Bonding Interconnection Technology By Hongjun JI Email:jhj7005@hit.edu.cn September 15, Key technologies in EP • Micro-joining technology – Assembling process and fabrication technology for materials and components that is precise-combined/bonded mechanically and electrically. • Applications – For assembling and fabrication of ultra small sized machine part, electronic components • Micro valve, ultra small sized motor, LCD module… – Required precision control in micro-order • Fine wire bonding, flip-chip packaging, thin film seam… 2 Advanced Bonding Interconnection Technology By Hongjun JI Email:jhj7005@hit.edu.cn September 15, Contents • Fundamentals of microjoining – Solid state bonding mechanism – Soldering and brazing mechanism – Fusion microjoining – Simulation • Techniques for microjoining and nanojoining – Wire bonding techniques in electronics – Solid state diffusion bonding – Soldering and brazing – Laser and electron beam microwelding – Resistance microwelding – Nanojoining • Materials cases and applications – Shape memory alloy, superconductor, SOFC, ceramics, plastics 3 Advanced Bonding Interconnection Technology By Hongjun JI Email:jhj7005@hit.edu.cn September 15