Effect of surface stresses on CuO nanowire growth in the thermal oxidation.pdfVIP

This article appeared in a journal published by Elsevier. The attached copy is furnished to the author for internal non-commercial research and education use, including for instruction at the authors institution and sharing with colleagues. Other uses, including reproduction and distribution, or selling or licensing copies, or posting to personal, institutional or third party websites are prohibited. In most cases authors are permitted to post their version of the article (e.g. in Word or Tex form) to their personal website or institutional repository. Authors requiring further information regarding Elsevier’s archiving and manuscript policies are encouraged to visit: /copyright Authors personal copy Chemical Physics Letters 512 (2011) 87–91 Contents lists available at ScienceDirect Chemical Physics Letters journal homepage: /locate/cplett Effect of surface stresses on CuO nanowire growth in the thermal oxidation of copper Rediola Mema a, Lu Yuan a, Qingtian Du b, Yiqian Wang b, Guangwen Zhou a,⇑ a Department of Mechanical Engineering Multidisciplinary Program in Materials Science and Engineering, State University of New York, Binghamton, NY 13902, USA b The Cultivation Base for State Key Laboratory, Qingdao University, No. 308 Ningxia Road, Qingdao 266071, China a r t i c l e i n f o a b s t r a c t Article history: By exerting bending stresses on a metal surface, we show that in-plane tensile stresses can effectively Received 16 May 2011 promote