半导体制造流程与IC产业链简介.pptVIP

Device Integration and Technology drive Device Integration and Technology drive Technology Road Map 1.2 Fab flow 1. Lithography concept and cycle 4. Transistor Layer (Front-end) definition 5. Routing Layer (Back-end) definition 3. Module composition and integration 2. Module definition Brief Process Flow - ILD Passivation P-sub NWELL STI PWELL Poly PR coating Poly Mask NLDD N-LDD N-PKT N-LDD N-PKT P-LDD PR P-LDD P-PKT N+ PR N+ N+ P+ PR P+ SAB PSG USG 9. Salicide Formation : 9.1 PETEOS-500A Cap Oxide dep. 9.2 SAB (Salicide-Block) Lithography (ellipsis) 9.3 Ti/Co sputtering