Gold Bump Process introduction.pptVIP

Why use Gold Bump? Gold Bump process flow Why can not Cp before Gold Bump? Gold Bump Parameter Gold Bump Failure Mode Gold Bump Issue Conventional flip chip UBM + solder and chip scale requirement Minimal chip processing before bonding Potential for yield improvement Fine pitch capability with increased stand-off height And, perhaps most importantly: Dry, lead-free bumping process IQC:identify any damage or problems that may impact the wafer bumping process. Special attention is given to common defects such as deep scratches, large particles, and I/O pad damage due to wafer probing. A solvent clean is done using acetone and isopropyl alcohol to remove any particles or marks on the wafers before beginning the bumping process. Removing the insulating aluminum oxide layer from the bond pad surface and making good electrical connection to the underlying metal. During this solvent clean, any ink dots on die will be removed, if possible, due to their possible impact on later processing. A blanket Under Bump Metallurgy UBM is deposited on the wafer. First, the UBM provides the mechanical interface between the solder bump and the I/O pad. Second, the UBM provides a seed layer that is both solder-wettable to mechanically join the solder to the UBM and low resistance for good wafer-scale electroplating uniformity . Third, the UBM provides a diffusion barrier between the I/O pad and the other metals in the UBM and solder system. Once the UBM is deposited, a thick photoresist is applied to the wafer and patterned to create openings down to the UBM. This is a very uniform process, as significant deviations in the size of these openings leads to non-uniform solder bump sizes in the final product. Difficult in using thick Photoresist 50~150um Coat, Align, Exposure Solder is then electroplated in these openings to a height calculated to provide the necessary final reflowed bump height. Bump height30-75um. Once the solder has been plated, the photoresist plat