e l e c t r o n i c p a c k a g i n g- e s d journal（e l e c t r o n我c p c k g n g - e s d杂志）（14页）.docVIP

ELECTRONIC PACKAGING IN THE 21st CENTURY by Stephen L. Fowler Fowler Associates, Inc. Tel: 864-574-6415 FAX: 864-576-4992 E-Mail: sfowler@ Web Site: March 16, 2000 Packaging of electronic products for shipment has developed rapidly over the past 30 years. Antistatic and other useful protective functions of the packages have progressed to a high technological state. This presentation reviews that progress, describes present technologies and forcast future trends. Antistatic technologies for loadings and coatings are covered both from a chemical as well as a practical point of view. Antistatic, dissipative, electrostatic and rf shielding properties are discussed. Test methods past, present and future are demonstrated. In this paper information is presented on new shrink film technologies which are just emerging. Automated packaging techniques as well as advances in moisture barrier packaging are discussed. Using air gaps as a method of electrostatic shielding has been around for a long time. New advances in thermoform and inflatable packages are covered. ? Copyright Fowler Associates, Inc. 2000 - All rights reserved History One may assume that the Chinese had problems with fireworks explosions due to static discharge centuries ago. The munitions industry has always had to be careful of static discharges. The APOLLO command module fire in 1967 was thought to be static related. Several premature or unintentional rocket ignitions have been blamed on static discharges. Today we may hear of gasoline pumps exploding due to static. Workers in detonator fuse assembly areas know too well the problems with static. These problems are known and assumed to be real. In the electronics industry the problems of static damage are more recent and less visible. In the early days of electronics, items such as vacuum tube devices and other extremely robust products from an ESD point of view