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4.設備管理 4-1.日常管理/daily monitor 4-2. PM 4-3. 測機 4-4.Through-put analysis and maintain 4-5. Error-code management 4-6. The trick of maintenance 4-7. SPC 5. Next generation and DUV laser:        6.重要名詞 Dark field vs. bright field detection Broad-band vs. narrow-band Digital vs. analog Image processing vs. scanning Phase grating Phase-shifting mask Off-axis illumination, QUEST ,SHRINC Pellicle Pellicle particle detector Cold mirror Non-edge contact pre-align Lamp uniformity Ghost image Alignment accuracy vs registration/overlay accuracy Interference filter CD control DOF UDOF TFD DP Lens tracking Interlock NEMA box Chuck, wafer- table Yield, line-yield Rework Throughput Notch, flat wafer Super-flat wafer, double side polished wafer Fiducial mark EMO Reticle, mask blind Arial image Integrator Half mirror 1/2 ,1/4λplate Relay lens Lens matching COO, cost of ownership COCOM Field size Laminar flow Isolate dense line/space Proximity effect Notching effect TARC BARC Organic ARC Non-Organic ARC CMP Shrink Repeat defect Threshold energy Over/under expose Bridging Substrate Grain size DEEP UV EBR / BSR Soft/ hard bake UV curing ADI/AEI AA SEM White band T-top In-line/ off-line On-line, SECS-2/GEM , automation 1 105