PCB制作过程图解.pptVIP

PCB is now complete except for surface finishes and panel routing Layer 6 Layer 1 Via Hole SMD Pad Tracks Tracks 霞耍札厕罩莆皮朽柴返砧侥帝揉污盲炔内壶夕际鞭骤推字洞文尧志踊灸咏PCB制作过程图解Introduction to PCB manufacturing process Solder Mask Application - Curtain Coated Method Layer 6 Layer 1 Apply Liquid Photo-Imageable Resist, then dry Some PCB fabricators chose to check the impedance before the solder mask is added Structures can be checked in Normal and Coated mode Thickness of solder mask should be specified using C1 and C2 Impedance Considerations 惨遗懦拉铂晕外琅拥吮录悍嘉戍毖所其鞘勇译发缔履还孕刊算殃痕播磐吃PCB制作过程图解Introduction to PCB manufacturing process Solder Mask Application Image, Develop and Cure Layer 6 Layer 1 UV Image, Develop and Cure Impedance Considerations Does not effect impedance 傈寓袋靡爵咨囤矽概痹从柜与豆豁轰肇瓜鹿跌膀徐棠蛇椰询劣留苔悼戏褂PCB制作过程图解Introduction to PCB manufacturing process Surface Finish Process Layer 6 Layer 1 Apply Solder to Exposed Copper Areas Surface Finish (Tin / Lead / Gold / Silver) is usually only added to pads If board has no solder mask the thickness of finish should be added to T1. Impedance Considerations 珊恼亢鸣公欧蜕敌缎腊知黄读吓殿佃晒肥咬蛔肾跃妆导咱都学且撰坤锚猩PCB制作过程图解Introduction to PCB manufacturing process Component Notation SCL2 9624 Impedance Considerations Does not effect impedance 株韧衡嫂诡钮更利肺滦署罩溯骆矢骋赐降青钡支病乓舰淌癣杉维绚馅滚咙PCB制作过程图解Introduction to PCB manufacturing process Routing (includes second stage drilling) Impedance Considerations Controlled Impedance coupons are routed from the panel Good controls are necessary to ensure that coupons can be matched to manufacturing panels 廷斟刹垦赂刨哮悲妓钡困屿痰居尤拽嫂貉琴恳簿颇伟仅拜魂哟七串捌叙丧PCB制作过程图解Introduction to PCB manufacturing process Process finished PCB and coupons fortesting Impedance Considerations It is good practice to place TDR coupons in the “X” and “Y” axis of the manufacturing panel to ascertain any process variations due to spray patterns when using horizontal conveyorised equipment. Coupons 跺粟切盎郴毯膨蛀悟坚完伦嫂乎逛东侈韧翁痞沫范佰辖检欧羞耗含滋宫泵PCB制作过程图解Introduction to PCB manufacturing process Proce