芯片前段制程流程课稿.ppt

制 程1 (Process 1:wafer process) ●晶片下线 (Epi wafer product) 芯片尺寸确定、电流扩散及打线电极制作 The determination of the chip’s size,current spreading and the electrode pad of the wire bonding. ●化学清洗（Cleaning） 用化学药品对晶片进行有机物和其它颗粒的去除，以及有些膜层的化学腐蚀。 Removing the organic and contamination from the chip by using organic solvent and acid,and thin film chemical etching . ●黄光光刻制程（Photolithography) 利用光刻胶的特性把图形转移到晶片上 Transfering the pattern to the wafer by using the photoresist . ●蒸镀刻蚀制程（Evaporation，Dry etching) 在外延片上蒸镀金属和ITO薄膜； Metal and ITO film is deposited on the wafer Process 1