OMG Fidelity ELECTROLESS NICKEL IMMERSION GOLDOMG富达化学镀镍浸金.pptVIP

OMG Fidelity ELECTROLESS NICKELIMMERSION GOLD Typical PCB Process Acid Clean ? Microetch ? Palladium Activate ? Electroless Nickel Plate ? Immersion Gold Plate Metal Finishing EN Formulations Low Phos. Chosen for solderablity. Heavy metal stab. Difficult to control. No longer in use for PCB processing. Mid Phos. Great general purpose plating. Not designed for PCB processing. Can skip plate. Still used for PCB processing. 9026M Electroless NickelSpecifically formulated for circuit boards Consistent deposition rate over a wide range of bath loading. No minimum work load! No Dummy panels! Self pH regulating. 1 to 1 replenishment. Easy to control. No bail-out, far less to waste treat. Works well with many types of soldermasks. Effect of Additive Balance For many years, certain compounds (typically two or three types) are used as additives in electroless nickel formulations at PPM levels. They must be in balance to get an optimal nickel deposit. Their balance or “ratio” has a large effect on the deposit characteristics. “Out of Balance”Deposit effects Low type 1 additive and/or high type 2 Rough deposits Tank plate-out Background plating Black pad and possibly skip plate Low type 2 and/or high type 1 Edge pull back Low plating rate Additive Levels When the additives are in balance, the deposit may appear normal. Higher than normal levels can cause problems that are not easy to detect. Assembly defects are usually detected too late. The goal is to eliminate the root cause of unseen defects rather than try to precisely control the levels. Real World Processing-  What Happens In Your Tank Cyanide Strip Test Indicates corrosion resistance of the nickel deposit. Does not show the difference between nickel oxide and bath by-products. Nickel oxide is normal and will not be a problem for assembly as long as the gold is present and of sufficient thickness. Strip time/temp and stripper bath composition have large effects on the appearance of the nickel.