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Study of thermal contact resistance of rough surfaces based on the practical topography.pdf
JID: CAF
ARTICLE IN PRESS
Computers and Fluids 000 (2016) 1–10
Contents lists available at ScienceDirect
Computers and Fluids
journal homepage: /locate/compfluid
[m5G;September 29, 2016;10:51]
Study of thermal contact resistance of rough surfaces based on the practical topography
Jian-Jun Gou a, Xing-Jie Ren a, Yan-Jun Dai a, Shuguang Li b, Wen-Quan Tao a,?
a Key Laboratory of Thermo-Fluid Science and Engineering, Ministry of Education, School of Energy Power Engineering, Xi’an Jiaotong University, Shaanxi 710049, China b Faculty of Engineering, University of Nottingham, Nottingham NG7 2RD, UK
article info
Article history: Received 3 February 2016 Revised 25 May 2016 Accepted 22 September 2016 Available online xxx
Keyword: Thermal contact resistance Rough surfaces Numerical simulation Practical topography
abstract
An approach is proposed to predict the thermal contact resistance (TCR) of rough surfaces. The practical rough topography of surfaces is measured by a contour pro?ler and is reconstructed to numerically analyze the mechanical and thermal contact performance. The studied material pairs are Ti-6Al-4V—Ti6Al-4V and C/C-SiC—high temperature ceramic (HTC). The TCR with air gap and vacuum gap conditions are calculated. The approach is validated by the comparison with experimental results of surfaces with the same topography at the same temperatures and loading pressures. The in?uence of thermal contact conductance between real contact asperities on the TCR of rough surfaces is studied. The approach can be used to predict TCR of different materials with different gap medium under different temperatures and loading pressures. The results show that the real contact area increases approximate linearly, while TCR decreases with the increasing pressure.
? 2016 Elsevier Ltd. All rights reserved.
1. Introduction
The measurement and prediction of thermal contact resistance between engineering rough surfaces are very essential for a precise thermal management. During the
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