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MRF6S21190HR3;MRF6S21190HR5;MRF6S21190HSR5;中文规格书,Datasheet资料
MRF6S21190HR3 MRF6S21190HSR3
1
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
Designed for W-CDMA base station applications with frequencies from 2110
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-
t ions. To be used in Class AB for PCN - PCS/cel lu lar rad io and WLL
applications.
? Typical Single -Carrier W-CDMA Performance: VDD = 28 Volts, IDQ =
1600 mA, Pout = 54 Watts Avg., Full Frequency Band, 3GPP Test Model 1,
64 DPCH with 50% Clipping, Channel Bandwidth = 3.84 MHz, Input Signal
PAR = 7.5 dB @ 0.01% Probability on CCDF.
Power Gain ? 16 dB
Drain Efficiency ? 29%
Device Output Signal PAR ? 6.1 dB @ 0.01% Probability on CCDF
ACPR @ 5 MHz Offset ? -38 dBc in 3.84 MHz Channel Bandwidth
? Capable of Handling 10:1 VSWR, @ 32 Vdc, 2140 MHz, 175 Watts CW
Output Power
Features
? 100% PAR Tested for Guaranteed Output Power Capability
? Characterized with Series Equivalent Large-Signal Impedance Parameters
? Internally Matched for Ease of Use
? Integrated ESD Protection
? Designed for Digital Predistortion Error Correction Systems
? Designed for Lower Memory Effects and Wide Instantaneous Bandwidth
Applications
? RoHS Compliant
? In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain-Source Voltage VDSS -0.5, +68 Vdc
Gate-Source Voltage VGS -0.5, +12 Vdc
Operating Voltage VDD 32, +0 Vdc
Storage Temperature Range Tstg - 65 to +150 °C
Case Operating Temperature TC 150 °C
Operating Junction Temperature TJ 200 °C
CW Operation @ TC = 25°C
Derate above 25°C
CW 175
1
W
W/°C
Table 2. Thermal Characteristics
Characteristic Symbol Value (1,2) Unit
Thermal Resistance, Junction to Case
Case Temperature 85°C, 120 W CW
Case Temperature 83°C, 56 W CW
RθJC
0.29
0.30
°C/W
1. MTTF calculator available at /rf. Select Software Tools/Development Tools/Calculators to access
MTTF calculators by product.
2. Refer to AN1955, Thermal
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