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Polyimide-based fusion of basal cell power chip development
PAGE \* MERGEFORMAT 13
Polyimide-based fusion of basal cell power chip development
Study: YIN Zheng-qin Hu Xiao-Lin Zheng Ning Yang Jun Xu Haiwei
Xing-Guo Zhang Yi Yang Jing Xia Cao Xu Feng Jiang Rong Yan Jiawen
[Abstract] based on flexible printed circuit board (flexible printed circuits board, FPCB) technology, through the surface of the polyimide film substrate etching copper foil laminated structure of the microelectrode array was prepared by a cell electrofusion chip. In the low voltage (≤ 40 V) power under the conditions of the cell fusion, 37% efficiency, far higher than the PEG (polyethylene glycol, PEG) method and traditional method of cell electrofusion. electric and traditional cell fusion systems, The chip can work at low voltage conditions, has a simple structure, low cost, can be observed during the experiment, the integration advantages of flux. In addition, polyimide film substrate can guarantee a good flexibility of this chip with other modules (such as Cell Isolation module) the effective integration of micro total analysis system with structure (micro total analytical system, μ TAS) of great potential.
[Keywords:] polyimide film, electronic integration, chip, micro-electrode, flexible printed circuit board
1 Introduction
With MEMS (micro electromechanical system, MEMS) technology, rapid development and the practical requirements of life science research, the cell electrical biochip technology integration and the combination of the gradual deepening of the chip on the cell electrofusion studies are more and more [1 5]. At present, the cell fusion chip integration of power flux is generally low [6], it is difficult to meet the requirements of efficient integration. In addition, cell electrofusion micro total analysis system (micro total analytical system, μ TAS) the concept of the chip integration and the overall package put forward higher requirements [7].
Integration with existing silicon processing chip major, but becau
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