基本焊线原理介绍幻灯片.pptVIP

Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Formation of a first bond Formation of a first bond Formation of a first bond Formation of a first bond Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Formation of a loop Formation of a loop Formation of a second bond Formation of a second bond Disconnection of the tail Disconnection of the tail Formation of a new free air ball pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead heat pad lead heat heat pad lead heat heat pad lead heat heat pad lead pad lead pad lead pad lead pad lead pad lead pad lead * ***什麼是 WIRE BOND *** L/F DIE 鋁墊 銲金線 一. W/B 銲線基本理論 : 二. BONDING (固態銲接)的四大基本要素 : 要如何才能得到最佳的銲接，主要要素如下 A. 壓力。(BOND FORCE) B. 振盪功率。(BOND POWER) C. 銲接時間。(BOND TIME) D. 銲接溫度。(TEMPERATURE) 1. 目前我們電子產品銲接是採用固態銲接， 所謂固態銲接，就是金屬在未達熔解溫度 下之銲接。決定固態銲接的要素有那些？ 1. 鋁墊之構造: a. 最上層為少量水氣與雜質 b. 第二層為氧化鋁 c. 第三層才是純鋁 d. 第四層是二氧化鋁 e. 最下層就是矽層 2. 最佳之銲接，就是金球與純鋁密切結合。 故如何運用四大基本要素，掌控最佳配合 時機為學習要旨。 如壓力、振盪過大會造成缺鋁或矽崩 過小昨則無法有效排除第一、二層與純鋁 層作密切接合銲接。 三. 金球與鋁墊之最佳銲接 : 溫度 溫度 金球 二氧化矽層 矽層 純鋁 玻璃層 水氣及雜質 氧化鋁 壓力 (FORCE) 振盪 (POWER) 金球與鋁墊的銲接模式 BONDING 時銲針位置之時序圖 RESET 位置 LOOP HEIGHT TO RESET 加速度 REVERSE LOOP 留線尾 燒一個金球 等速度 逆打 等速度 1 ST BOND TIME KINK HEIGHT 2 ND BOND TIME 銲 針 高 度 TIME 時間 L/F DIE 鋁墊 銲金線 * WIRE BOND * pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead heat PRESSURE Ultrasonic Vibration pad lead Ultra Sonic Vibration heat PRESSURE pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead