SMT 缺陷.pdfVIP

STENCILSMT 2-1SMT THTSMTTHTSMT SMT STENCIL2P3S STENCILSMT 2-2SMT SOLDER BALL BRIDGE COMPLANATION OFFSET TOMBSTONE UNDESIRABLE WETTING SOLDER POINT DEFECT SOLDER VOLUME FAULT COMPONENTS FAULT STENCILSMT 2-2SMT 1SOLDER BALLS PCB STENCIL Solder ball • Solder balls are spheres of solder that remain after the soldering process. Solder balls violate minimum electrical clearance. . • Solder fines are typically small balls of the original solder paste metal screen size that have splattered around the connection during the reflow process. . 17 Solder ball Countermeasure/ 1. Stencil Aperture do not focus to pad: improve stencil aperture opening. : . 2. Printing misalignment: Fine tune print machine. : . 3. Excess paste : Cpk control. : Cpk. 4. Damp PCB : Bake the PCB before loading it to SMT. PCB: SMTPCB. 6. Stencil polluted: clean the stencil. : . 7. Profile ramp up is too fast : Optimize reflow profile. : . 8. Paste oxidized: exchange with fresh solder paste. : . 9. Chip wave or solder wave height is too high caused excess solder to top side: adjust the wave soldering height to proper level (wave solder). : ( ). 18 STENCILSMT 2-2SMT 2(BRIDGE