高热导绝缘基板.PDF

散熱基板之特性需求 製造成本：面積極大化、厚度、搭配金屬多樣化 熱傳導率： ≧150 W/M-°K (BN, ALO) 熱膨脹係數匹配性：高溫下穩定性 複雜形狀的製程可行性 (減少加工成本) ：絕緣層圖案化 基材的金屬化性：同96％Al O (真空濺鍍Cu) 2 3 基材之平坦度：同96％Al O Ra＜2μm(粗糙度) 2 3 加工裕度：乾膜貼合、壓合、沖壓、切割、雷射 表面處理性：耐化學酸鹼（陶瓷面） 陶瓷基材電性：絕緣性＞1012Ω 、電場強度＞4KV(高溫 下) 製程示意-single side Al O sol-gel 2 3 2mm Low Temperature curing ≦300℃ Al O flake 50μm ：厚度均勻性 2 3 製程示意-2 sides Al O sol-gel 2 3 Al O flake 25μm 2 3 Low Temperature curing ≦300℃ clad 結構 What combines Alumina and Cu together? Target : Metal TIM/solder as adhesive between Alumina flake and Cu Polymer : bad to heat transfer, increase RTH , but easiest at this moment 挑戰 • Adhesive • Bubble formed in the adhesive • Warpage (板翹) after Alumina flake cured on Cu • TCE mismatch between Al and Cu(高溫下 可靠度) • Mechanical strength of flake ：Punch, Drill, Routing CheckPoint-phase I • sample appears:dimension can supply • Thermal conductance measurement → 2 sides structure →Cu t 1mm, flake t 50μm, 50X50mm • Electric, mechanical, measurement