常见英文EQ描述.docVIP

Common Query I. Board thickness 1. Lay-up 2. Mismatch between the lay-up board thicknesses 3. Relax board thickness tolerance II. Carbon ink III. Cu thickness Pad 1. Add Cu clearance for NPTH or consider 2nd-drill 2. Add dummy pattern 3. Copper close to board edge 4. Copper extending to unit edge 5. Delete NPTH pad 6. Distance between two pads less than 4mil 7. Isolated fiducial mark 8. No space to enlarge pads to ensure 2mil annual ring 9. Pad size is too small 10. PTH hole with elliptic pad 11. Relax Cu thickness on outer layer 12. Relax Cu thickness on outer layer IV. DWG 1. Label in DWG is undefined 2. No DWG with dimension 3. Unit DWG size is small V. General criteria 1. Common criteria 2. E/T stamp 3. Our logo 4. X-out VI. Gold finger 1. Delete solder mask bridge between gold fingers 2. Relax tolerance for bevel size 3. Relax beveling angle or disregard the remaining thickness 4. Space between gold finger edge and outline is too narrow 5. Space between test pad and the top of gold finger is too narrow VII. Hole 1. Blind/buried hole 2. Breakaway hole is partially on copper plane 3. Change overlapped hole as slot 4. Drilling positional tolerance 5. Relax tolerance for NPTH 6. Relax tolerance for PTH 7. Repeated hole 8. Routing hole 9. Rectangular hole VIII. Impedance 1. Calculated value trends to the limit 2. Match impedance 3. Reference plane 4. Which trace should be controlled IX. Inner corner Right angle X. Outline dimension 1. Connection tab far away from unit edge 2. Mismatch between CAD/CAM data and DWG 3. Miss dimension 4. Narrow connection area between breakaway holes 5. No tooling hole 6. Relax tolerance for outline dimension 7. Uneven tolerance 8. Useless dimension 9. Add overshoot XI. Packing XII. Peelable solder mask 1. Peelable solder mask covered hole 2. Peelable solder mask plugged hole 3. Relax thickness for peelable solder mask 4. Without the detail dimension of peelable solder mask XIII. Silkscreen 1. Marking in hole or pad