离子布植掺杂物及锌覆盖层对镍化矽热稳定性影响-国家奈米元件实验室.PDFVIP

2 23 NANO COMMUNICATION19No.1 Improve Thermal Stability Behavior of Nickel Silicide with Ion Implantation Species and Zn Capping Layer 1 1 2 1 1* 1 2 700 oC Abstract In t his work, we investigated t he inf luence of B, BF , As and P ion implantation on t he t hermal stability and elect rical 2 behavior on t he interlayer nickel silicide NiSi film. T he B/ BF species ion implantation can prevent t he nickel silicide 2 from agglomeration and phase transformation, on the contrary, the As/ P species ion implantation cant prevent the nickel silicide from surface agglomeration eectively. This result is contributed to that the thermal stability of B and BF2 species ion implantation is better than the As and P species ion implantation. In additional, when the Zn interlayer was instead of TiN capping layer to form the nickel silicide, the thermal stability of the nickel silicide was improved. As or P nickel silicide based on the Zn interlayer has disordered grains and agglomerated situation on the surface until 700 oC, however, B or BF2 nickel silicide based on the Zn interlayer shows a high thermal stability at 700 oC Keywords Zn Interlayer NiSi Ions Implant Agglomeration