助焊剂罕见状态与剖析-同方科技_20140927(国外英语资料).doc

助焊剂常见状况与分析-同方科技Analysis and multi board PCB board, a dirty residue after welding flux common situation: 1. before welding without preheating and preheating temperature is too low (dip, short time). The 2. approach is too fast (FLUX not fully volatile). 3. furnace temperature is not enough. 4. tin liquid is added with anti oxidant or anti oxidation oil. 5. flux coating too much. The 6. element foot is out of proportion to the plate hole (Kong Taida) that causes the flux to rise. 9.FLUX use process, for a long time did not add thinner; two, fire: 1., wave furnace itself no wind knife, resulting in excessive coating flux, preheating when dripping into the heating tube. The angle of the 2. air knife is incorrect (uneven coating of the flux on the PCB). Too much tape on the 3.PCB causes the bar to ignite. The 4. approach is too fast (FLUX not fully volatile, FLUX drop) or too slow (caused by hot plate temperature is too high). 5. technical problems (PCB plate heat pipe and the PCB is not good at the same time too close); three, corrosion (components of green, black spot is not sufficient (1.) preheating and preheating temperature is low, equal speed) caused by FLUX residues of harmful residues, too much). 2. the use of cleaning flux, after welding is not cleaned or not cleaned in time; four, even power, leakage (bad insulation), PCB design is unreasonable, wiring is too close. The quality of PCB solder mask is not good, easy conductive; five, weld, weld, solder FLUX coating amount is too small or not uniform. Some of the pads or pads are seriously oxidized. PCB wiring is unreasonable (parts are not distributed properly). The foam pipe is blocked and uneven foaming, resulting in uneven coating of FLUX on the PCB. Improper handling of hand dipped tin. The chain angle is not reasonable, the crest level; six, the solder joint is too bright or not bright spot 1. to solve this problem through the choice of light type or extinction type FLUX); 2. for tin is not good