冷却速率对sn-ag-cu 无铅焊料ag3sn 形貌及拉伸强度之研究 - yoke.pdf

冷卻速率對Sn-Ag-Cu 無鉛銲料Ag Sn 形貌及拉伸強度之研究 3 Effect of Cooling Rate on the Ag3Sn Morphology and Tensile Strength of Sn-Ag-Cu Lead-Free Solder 1 2* 1 1 1 林冠宇 、李驊登 、陳銀發 、林哲緯 、張銘峰 K. Y. Lin H. T. Lee* C. W . Lin M. F. Chang 1 國立成功大學機械工程研究所研究生 2 國立成功大學機械工程研究所教授 plate-like. The Ag3Sn particles have an average 摘要 diameter of about 0.2µm by fast cooling. The tensile 本研究的目的在探討冷卻速率差異對Sn-3.0Ag strength is reduced as Ag3Sn is coarsened. The tensile strength for SAC305 decreased from 60.8MPa to -0.5Cu及 Sn-3.8Ag-0.7Cu(簡稱 SAC305 、SAC387)無 39.5MPa. SAC387 solder possesses more Ag and Cu 鉛銲料的金屬間化合物 Ag Sn 與 Cu Sn 形貌變化之 3 6 5 addition than SAC305, and its tensile strength decreased 影響。並使用拉伸試驗來評估不同冷卻速率下 ，無鉛 more seriously due to the formation of coarse primary 銲料拉伸強度性質的影響。 Ag3Sn compounds. Cracks tend to occur at plate-like 研究結果顯示，冷卻速率對金屬間化合物凝固成 primary Ag3Sn compound and extend into the matrix by 長時間有顯著的影響，造成Ag3Sn化合物尺寸及形貌 SAC387 specimens under slower cooling. As a result, 上的變化。無鉛銲料隨冷卻速率下降，Ag3Sn化合物 precipitation of such large and brittle primary 形貌變化顆粒狀: →針狀→板片狀，以快