Michael quirk_半导体制造技术-第13章_光刻_气相成底膜到软烘.pptVIP

Figure 13. Semiconductor Manufacturing TechnologyMichael Quirk Julian Serda ? October 2001 by Prentice HallChapter 13 Photolithography: Surface Preparation to Soft Bake Objectives After studying the material in this chapter, you will be able to: 1. Explain the basic concepts for photolithography, including process overview, critical dimension generations, light spectrum, resolution and process latitude. 2. Discuss the difference between negative and positive lithography. 3. State and describe the eight basic steps to photolithography. 4. Explain how the wafer surface is prepared for